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前言 质量是企业的生命,作为高新技术产业的PCB行业更是如此。高精度要求带来的高报废率始终困扰着企业。随着微电子技术的飞速发展,促使信息处理技术和信息通讯技术成为高信息化科学领域和发展的两大支柱。这些发展趋势要求选择封装密度更高,高度集成化微型器件与之相配套的高密度的支承件——印制电路板。在生产上运用SPC(Statistical ProcessControl)统计过程控制方法。毫无疑问这种方法的重要性为众多企业所接受,并在实践中证明此种科学方法是解决诸多技术难点与热点问题的重要途径。
Preface Quality is the life of an enterprise, especially as a high-tech industry PCB industry even more so. The high rejection rate brought by high-precision requirements has always plagued the enterprise. With the rapid development of microelectronic technology, information processing technology and information communication technology have become the two pillars of high information science and development. These trends call for the choice of high-density supporters - printed circuit boards - with higher package densities and highly integrated micromodules. In the production of SPC (Statistical ProcessControl) statistical process control methods. There is no doubt that the importance of this method is accepted by many enterprises and proved in practice that this scientific method is an important way to solve many technical difficulties and hot issues.