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采用自由基聚合法制备了温敏高分子聚合物PNIPAm,并利用两亲性聚合物在选择性溶剂中的自组装制备出PNIPAm与纳米Cu2O的温敏复合材料;利用红外光谱仪(FT-IR)和紫外-可见吸收光谱仪(UV-Vis)对聚合物的结构和温敏性进行表征,并用扫描电子显微镜(SEM)和激光共聚焦显微镜(LSCM)对复合材料进行结构表征;通过抑菌实验考查温敏复合材料的缓释性能。实验结果表明:制得的PNIPAm凝胶最低临界溶解温度(LCST)约为32.5℃;交联剂摩尔分数(占单体的物质的量)从2%增大到4%时,凝胶溶胀度下降40%;抑菌实验发现,温敏复合材料对氧化亚铜的缓释效果明显。
The temperature-sensitive polymer PNIPAm was prepared by free-radical polymerization. The thermal-sensitive composites of PNIPAm and Cu2O were prepared by self-assembly of amphiphilic polymers in selective solvents. The structures and thermal sensitivities of the polymers were characterized by UV-Vis absorption spectroscopy. The composites were characterized by scanning electron microscopy (SEM) and confocal laser scanning microscopy (LSCM) Slow release properties of temperature sensitive composites. The experimental results showed that the lowest critical solution temperature (LCST) of PNIPAm gel was about 32.5 ℃. When the mole fraction of crosslinker (the amount of monomer) increased from 2% to 4%, the gel swelling degree Decreased by 40%. Antibacterial experiments showed that the thermo-sensitive composite material has a slow release effect on cuprous oxide.