科峰与韩国SLT在沈阳建集成电路厂

• 作 者: 程文芳
• 出 处: 半导体信息
• 发表日期: 2003年01期
• 关键词: SLT 芯片研发 浑南新区 一期工程 芯片生产线 设备引进 设备选型 生产技术 生产设备 可行性报告

最近,香港科峰集团、韩国 SLT 株式会社和沈阳浑南新区就三方联合在浑南新区建立6—8英寸集成电路生产厂,签订了“启动集成电路项目协议书”。协议规定,该项目总投资3亿美元。拟分两期进行:一期工程投资2亿美元,于2003年初动工兴建,建设一条月产量5千块6英寸芯片研发及生产线;二期工程投资1亿美

Recently, Hong Kong Kefeng Group, South Korea SLT Co., Ltd. and Shenyang Hunnan New Area jointly established a 6-8-inch integrated circuit manufacturing plant in Hunnan New Area with the tripartite alliance and signed the Agreement for Startup of Integrated Circuits Project. The agreement stipulates that the total investment of the project is 300 million U.S. dollars. It is planned to be carried out in two phases: a project with an investment of 200 million U.S. dollars was started in early 2003 to build a production and research and development line of 5 thousand 6-inch chips per month;