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通过非等温示差扫描量热分析(DSC),热重分析(TGA)及物理力学性能测试研究了分别以双氰胺、二氨基二苯基砜、线形酚醛树脂为固化剂,2-甲基咪唑为固化促进剂的环氧树脂体系的固化行为,热稳定性及其粉末涂料性能,并利用外推法求出不同固化体系的理论固化温度。结果表明:双氰胺/2-甲基咪唑体系的综合性能最好,其理论固化温度为142℃,热失重起始分解温度为410℃,冲击强度为50 cm,60°光泽为83,表面电阻为1.33×1012Ω。
The effects of dicyandiamide, diaminodiphenylsulfone, phenol novolac resin and 2-methylimidazole were studied by non-isothermal differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and physical and mechanical properties tests. As curing accelerator epoxy resin curing behavior, thermal stability and powder coating properties, and the use of extrapolation method to calculate the different curing system of the theoretical curing temperature. The results showed that: the dicyandiamide / 2-methylimidazole system has the best comprehensive performance, the theoretical curing temperature is 142 ℃, the initial decomposition temperature of TGO is 410 ℃, the impact strength is 50 cm, the gloss at 60 ° is 83, The resistance is 1.33 × 1012Ω.