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CuCr50真空触头材料经深冷处理后 ,抗电弧烧蚀性能明显提高。本文利用电子探针、能谱、显微硬度测试等手段 ,对CuCr50合金深冷处理前后的显微组织和性能进行了对比分析。结果表明 :CuCr50合金深冷处理后 ,显微孔洞明显减少 ,Cu基体孪晶增多 ,表面出现弥散分布的细小Cr颗粒。说明在深冷过程中 ,显微孔洞焊合 ,致密性增加 ,Cu基体的纯度增加 ,电极导热性、导电性随之增加。这种组织与性能的变化使真空开关的抗电弧烧蚀能力及开断能力得到较大改
CuCr50 vacuum contact material after cryogenic treatment, anti-arc ablation performance was significantly improved. In this paper, by means of electron probe, energy spectrum, microhardness test and other means, the microstructure and properties of CuCr50 alloy cryogenic treatment before and after the comparative analysis. The results show that after the cryogenic treatment of CuCr50 alloy, the microscopic pores are obviously reduced, the twin of the Cu matrix is increased, and fine Cr particles with diffuse distribution appear on the surface. It shows that in the cryogenic process, the micro-holes are welded and the density increases, the purity of the Cu matrix increases, and the thermal conductivity and conductivity of the electrodes increase accordingly. Such changes in the organization and performance of the vacuum switch anti-arc ablation ability and breaking capacity have been greatly changed