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在常规印制电路板的表面覆合漏空的绝缘层和铝板,做成新颖的印制电路板,即导热印制板。与常规印制板相比,导热印制板具有与之相当的焊接性能和加工性能,但具有常规印制板所缺乏的高导热性、高抗干扰能力,以及较高的耐热、耐燃及结构稳定性。在电子产品中使用导热印制板可以有效地提高设备可靠性。延长使用寿命,并可以不用或少用散热器,从而缩小体积。导热印制板是印制电路板热设计的一种新颖结构形式。本文说明了导热印制板的结构原理,概要地介绍了研制过程、工艺方法及性能测试,较详细地叙述了应用试验情况和使用效果,并对导热印制板的特性作了分析归纳。
On the surface of the conventional printed circuit board with insulation blanket insulation and aluminum, made of a new printed circuit board, the thermal conductivity of printed circuit boards. Compared with the conventional PCB, thermal PCB with comparable performance and processing performance, but with the conventional printed circuit board lack of high thermal conductivity, high anti-interference ability, and high heat, flame and Structural stability. The use of thermally conductive printed circuit boards in electronic products can effectively improve equipment reliability. Extend the service life, and can use less or less heat sink, thereby reducing the size. Thermally printed boards are a novel form of thermal design for printed circuit boards. This paper describes the structure and principle of the thermal conductive PCB, briefly introduces the development process, process methods and performance testing, describes in detail the application of the test conditions and the use of results, and analysis of the characteristics of the thermal conductive PCB.