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以C72500(Cu-9.5Ni-2.3Sn)合金为研究对象,采用了金相显微镜、SIGMASCOPE SMP10型导电仪、XL30/TWP扫描电镜(SEM)、EDAX能谱仪、X射线衍射仪等仪器,研究不同Si含量(0.15%,0.20%,0.25%)对C72500合金铸锭的显微组织、电导率、硬度的影响。实验研究结果表明:随着Si在C72500合金中含量的不断增加,合金铸态组织呈现明显的树枝晶状,且枝晶发达,晶粒不断得到细化。能谱分析显示:未添加硅的Cu-9.5Ni-2.3Sn合金中第二相主要是NiSn和Ni3Sn相。随Si含量的增加,合金中第二相的种类不断增加,合金中出现Ni2Si,Ni3Si相。Ni2Si,Ni3Si是强化相,且新产生的第二相使合金组织晶格畸变更小,因此,铸态C72500合金的硬度及电导率随硅含量的增加而提高。当Cu-9.5Ni-2.3Sn合金中的Si含量为0.25%时,铸态合金的电导率和硬度分别为11.8%IACS和HB171.7,比未为添加硅Cu-9.5Ni-2.3Sn合金的电导率及硬度分别增加了24.2%和242.0%。
Taking C72500 (Cu-9.5Ni-2.3Sn) alloy as the research object, metallurgical microscope, SIGMASCOPE SMP10 conductivity meter, XL30 / TWP scanning electron microscope (SEM), EDAX spectrometer and X-ray diffractometer were used to study Effect of Different Si Content (0.15%, 0.20%, 0.25%) on Microstructure, Conductivity and Hardness of C72500 Alloy Ingots. The experimental results show that with the increasing of Si content in C72500 alloy, the as-cast dendritic structure of the alloy shows obvious dendrites, and the dendrites are developed and the grains are continuously refined. EDS analysis showed that the second phase of Cu-9.5Ni-2.3Sn alloy without Si was mainly NiSn and Ni3Sn phases. With the increase of Si content, the type of the second phase in the alloy increases continuously, Ni2Si and Ni3Si phases appear in the alloy. Ni2Si, Ni3Si is a strengthening phase, and the newly generated second phase makes the alloy lattice distortion smaller, so the hardness and electrical conductivity of as-cast C72500 alloy increases with increasing silicon content. When the content of Si in Cu-9.5Ni-2.3Sn alloy is 0.25%, the electrical conductivity and hardness of as-cast alloy are 11.8% IACS and HB171.7, respectively, which are lower than that of silicon alloy Cu-9.5Ni-2.3Sn Conductivity and hardness increased by 24.2% and 242.0% respectively.