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利用喷射成形技术制备了60Si40Al合金新型电子封装材料。研究了各工艺参数对沉积坯件的影响,确定了较佳工艺参数。研究了材料的显微组织以及沉积态合金在加热保温过程中的组织转变规律,确定了热等静压温度,进行了热等静压致密化处理。研究结果表明:材料显微组织细小,一次硅相尺寸约为10μm,且均匀弥散分布,该材料的热膨胀系数为9×10-6～10×10-6/K,热导率约为110W/(m·K),是一种理想的电子封装材料。
A new type of electronic packaging material of 60Si40Al alloy was prepared by spray forming technology. The effects of various process parameters on the deposition blank were studied, and the better process parameters were determined. The microstructure of the material and the microstructure transformation of the as-deposited alloy during heating and soaking were studied. The hot isostatic pressing temperature was determined and the hot isostatic pressing was carried out. The results show that the microstructure of the material is small and the size of the first silicon phase is about 10μm. The thermal expansion coefficient of the material is 9 × 10-6 ~ 10 × 10-6 / K and the thermal conductivity is about 110W / (m · K), is an ideal electronic packaging materials.