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本文以管芯为主，讨论了如何从工艺角度，实现高输入阻抗，涉及的主要工艺有：栅氧化、蒸发、光刻。
In this paper, the die-based, discussed how to achieve high input impedance from the process point of view, the main processes involved are: gate oxidation, evaporation, lithography.