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采用硫酸溶液作为抛光液对轧制辅助双轴织构技术制备的Ni5W合金基带进行电化学抛光,在不同的抛光液浓度下获得了表面状态不同的基带。利用X射线光电子能谱(XPS)、X射线衍射(XRD)、扫描电镜(SEM)等手段研究了抛光过程中表面物质相成分及成因。结果表明:抛光液浓度较低时基带表面会形成过量的氧化物和H2WO4,造成表面选择性溶解过程紊乱,导致无法抛光。通过优化抛光液浓度可在基带表面获得适当厚度的固体层和粘液层,电流通过时可获得良好的抛光效果。
The Ni5W alloy substrate prepared by rolling assisted biaxial texturing was electrochemically polished with sulfuric acid solution as the polishing solution, and different surface states were obtained at different polishing solution concentrations. The composition and genesis of surface materials in the polishing process were studied by means of X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD) and scanning electron microscopy (SEM) The results show that when the concentration of polishing solution is low, excessive oxide and H2WO4 are formed on the surface of the substrate, resulting in the disorder of surface selective dissolution process, which leads to non-polishing. By optimizing the concentration of the polishing solution, a solid and mucus layer of appropriate thickness is obtained on the surface of the substrate, and a good polishing effect is obtained when the current passes.