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通过EET和TFD两种理论计算了CuCrSnZn合金的相空间和析出相界面的电子结构,并分析了合金电子结构对其强度和软化温度的影响。结果表明,合金中的电子排列密度ρCr为29.67/nm2,ρCu为34.22/nm2,密度差Δρ为14.2%。相界面电子密度越大,合金的强化就越明显。相界面电子密度差越大,合金的软化温度就越高。
The electronic structure of the phase space and precipitation phase interface of CuCrSnZn alloy was calculated by EET and TFD. The influence of the electronic structure of the alloy on the strength and softening temperature was also analyzed. The results show that the electron density ρCr is 29.67 / nm2, ρCu is 34.22 / nm2, and the density difference Δρ is 14.2%. The larger the electron density of the phase interface, the more pronounced the strengthening of the alloy. The larger the electron density difference at the interface, the higher the softening temperature of the alloy.