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针对用磁控溅射方法制备的NiFe/Cu多层膜进行了热处理研究。经退火后,NiFe/Cu多层膜的磁电阻有了显著的变化,在250℃的最佳退火温度下,最大磁电阻变化率为5.2％。
The heat treatment of NiFe / Cu multilayers prepared by magnetron sputtering was studied. After annealing, the magnetic resistance of NiFe / Cu multilayered films changed significantly. The maximum change rate of magnetoresistance was 5.2% at the optimal annealing temperature of 250 ℃.