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对于从带散热片的LSI(大规模集成)组件和冷却气流之间热阻的研究是通过将其物理模型与传热试验结果、气流的形象试验和压降测试相结合来完成的。虽然粗略的假设常用于分析模拟试验,但是对传热和压降预测所推荐的方法已被证明是非常适合于完成冷却系统的设计任务。值得注意的发现是通过在插件板上交叉排列组件可获得明显的好处。它将减小局部空气温升,温升仅为通常成直线排列时的70％,直线排列时风扇是作强制冷却用的。
The study of thermal resistance from an LSI with heatsink assembly and cooling airflow was done by combining its physical model with heat transfer test results, airflow image and pressure drop tests. Although the rough assumptions are commonly used in analytical simulation tests, the recommended methods for predicting heat transfer and pressure drop have proven to be well suited for the design of cooling systems. Noteworthy findings are obvious benefits by cross-packing the components on the board. It will reduce the local air temperature rise, the temperature rise is usually only 70% of the straight line, the fan is forcibly cooled with a straight line arrangement.