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我厂使用铜制与不锈钢母板的长期生产实践表明:由于皂剂在铜母板上的附着力较差,经常发生始极片很难剥离,且形状残缺不全,成张率极低,甚至有时低到50%以下;母板使用期稍长时,往往因导电不良,受酸腐蚀,表面形成许多麻点,而影响始极片表面的平整和光洁度。特别是当母板发生烧板后,由于母板上的皂剂膜被破坏,始极
The long-term production practice of our factory using copper and stainless steel motherboards shows that due to the poor adhesion of the soapstock on the copper motherboard, it often happens that the starting electrode chip is difficult to peel, and the shape is incomplete, the tension rate is very low, or even Sometimes as low as 50%; motherboard slightly longer, often due to poor conductivity, acid corrosion, the surface of the formation of many pits, and the impact of the first pole piece surface smoothness and finish. Especially when the motherboard burning plate, because the motherboard soap film is destroyed, the beginning