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介绍用非晶硅微型辐射热量计制成的160×120元非致冷红外焦平面阵列的特点和性能,该阵列集成在一个无铅芯片载体封装中,像素间距为25μm,适合于大批量生产。25μm像元结构得益于较小的热时间常数,该技术使我们能够设计出更高的热隔离性能,从而能以35μm技术为基础开发出25μm技术。通过采用新的像素设计和更进一步推动设计方法,在没有采用复杂昂贵的双层结构的前提下,保持了较高填充因子。从读出集成电路结构、封装、可操作性和光电性能入手对该探测器进行了介绍。为该探测器设计了一种新型集成读出电路。可以通过串行链接对增益、图像翻转和积分时间等高级功能进行操控,降低电气对接的数量。研制的小型无铅芯片载体封装便于大规模生产探测器,主要用途为便携式摄像机或头盔摄像机。
The characteristics and performance of a 160 × 120 uncooled infrared focal plane array made of amorphous silicon micro-radiation calorimeter are introduced. The array is integrated into a lead-free chip carrier package with a pixel pitch of 25μm and is suitable for mass production . Thanks to the smaller thermal time constant, the 25μm pixel structure allows us to design higher thermal isolation properties, enabling 25μm technology to be developed on the basis of 35μm technology. By adopting a new pixel design and further promoting the design method, a higher fill factor is maintained without using a complicated and expensive double-layer structure. The detector is introduced by reading out the integrated circuit structure, package, operability and optoelectronic performance. A new integrated readout circuit has been designed for this detector. Advanced features such as gain, image flipping, and integration time can be manipulated through the serial link to reduce the number of electrical connections. Developed small lead-free chip carrier package for large-scale production of detectors, the main purpose for the camcorder or camcorder.