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半导体生产设备厂商应用材料公司(Applied Material)近日表示它正同半导体贸易组织Sematech合作定义利用铜作导体加工芯片的生产工艺,并对铜导体芯片制造过程中的抛光工艺进行改进。今年末,IBM将发布使用铜导体工艺的PowerPC处理器和微处理器电路金属线。在使用铜金属后,芯片体积会更小,速度会更快。铜的导电性比通常处理器使用的金属铝好得多,因此铜很有可能取代铝成为未来芯片发展趋势,使用铜工艺的芯片主频很容易达到600MHz以上。在0.18微米生产工艺普及后,铜电路应用市场将真
Applied Materials, a maker of semiconductors, said recently that it is working with Sematech, a semiconductor trade group, to define production processes that use copper for conductor processing chips and to improve the polishing process in the manufacture of copper conductor chips. Later this year, IBM will announce PowerPC processors and microprocessor circuit metal lines using copper conductor technology. After using copper metal, the chip size will be smaller, faster. The electrical conductivity of copper is much better than the metal aluminum used in typical processors, so copper is likely to replace aluminum as the future of chip development. The frequency of chips using copper technology is easily reached above 600 MHz. After 0.18 micron production technology is popularized, the application market of copper circuit will be true