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为了适应印制板发展的需要,各种新型材料正在逐步开发并投入使用。本文就国内外目前在印制电路板新型基材方面的研究和运用作一综述,并着重分析和例举一系列典型材料,如聚砜、聚酰亚胺、聚四氟乙烯,并将它们在热膨胀系数,玻璃化温度,介质损耗,介电常数,表面电阻,体积电阻等方面作了具体分析和比较。从中可以看出,这些材料比目前广泛使用的环氧树脂具有更优异的力学性能和电性能。能适应于印制板向高精度,高密度,高可靠性方向发展的需要。本文还对生产工艺简单,成本低的注塑型印制板作了介绍。
In order to meet the needs of the development of PCB, a variety of new materials are gradually developed and put into use. This paper reviews the current research and application of new substrates for printed circuit boards at home and abroad, and focuses on analyzing and enumerating a series of typical materials such as polysulfone, polyimide and polytetrafluoroethylene In the thermal expansion coefficient, glass transition temperature, dielectric loss, dielectric constant, surface resistance, volume resistivity and so made a specific analysis and comparison. It can be seen that these materials have more excellent mechanical and electrical properties than currently widely used epoxy resins. Can adapt to the PCB to high-precision, high density, high reliability direction of development needs. This article also introduced the production process is simple, low cost injection molding PCB.