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在分析现有的集成路互连线失效评估模型的基础上 ,提出了一种考虑丢失物缺陷影响的IC互连接线电迁移损失新模型 .在 IC电路设计中 ,这种新模型可用于估计与丢失物缺陷及其它因素有关的 IC互连线电迁移损失
Based on the analysis of the existing interconnection failure assessment model of integrated circuit, a new model of electromigration loss of IC interconnection wiring considering the influence of missing material defects is proposed. In IC circuit design, this new model can be used to estimate Loss of Electromigration on IC Interconnect Related to Lost Defects and Other Factors