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本文介绍了一种新的铝箔连接方法。通过在铝箔表面真空蒸镀铜的工艺措施,采用机械热脉冲压焊,实现了45μm厚的Al箔的大气环境下的连接。这种方法的实质是通过低熔共晶反应,在接合面上产生液相层。通过对脉冲变压器原边电压U、脉冲时间τ以及合理的镀层厚度δ之间的综合协调控制,可以控制中间液相层的厚度,并且能使1mm宽的焊点承受50-100g/mm的撕裂力。本文还通过金相显微镜,SMT等分析手段,对焊点的形成过程进行了初步分析。
This article describes a new aluminum foil connection method. Through the process of vacuum evaporation of copper on the surface of the aluminum foil, mechanical hot stamping was used to achieve the connection of 45 μm-thick Al foil in the atmosphere. The essence of this method is to produce a liquid-phase layer on the bonding surface by a low-melting eutectic reaction. Through the comprehensive coordination of the pulse transformer primary voltage U, pulse time τ and reasonable coating thickness δ between the control of the thickness of the intermediate liquid phase, and can make 1mm wide solder joints to withstand 50-100g / mm tear Split force. In this paper, metallographic microscope, SMT and other analytical tools, the formation process of solder joints were analyzed.