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微处理器从8008/8080发展到Pentium二代,制造工艺水平从1.5微米提高到0.25微米,集成晶体管的数目也提高了几个数量级,由最初的3500个到现在的K6有880万个。而6月2日,AMD公司已正式向中国推出了其最新的内含930万个硅晶体的新型K6级微处理器——AMD K6-2。由于采用了0.25微米五层金属工艺制造技术和局域互连、浅沟隔离的生产工艺,K6-2实现了在81平方毫米面积上集成930万个晶体管的重大突破,相比之下Intel公司的PentiumⅡ还停留在750万这一数量级上。正是有了这180万个硅晶体管,AMDK6-2才得以在保持与SOCKET7脚张数相同的Super7平台上,实现了与采用SLOT1的Intel PⅡ级芯片相同的100MHz外频总线,较以前66MHz的Socket 7总线接口快50％,而系统性能可提高两级(以处理器速度计)。更重要的是,由于采用了AMD创新的3DNow!技术,K6-2向全球客户提供了全新水平的三维性能及逼真的图形效果。
Microprocessors evolved from the 8008/8080 to the second generation of the Pentium, with manufacturing processes rising from 1.5 to 0.25 microns. The number of integrated transistors has also increased by several orders of magnitude, from 8.8 million in the initial 3500 to the current K6. On June 2, AMD officially launched its new K6 microprocessor, AMD K6-2, with 9.3 million silicon crystals in China. The K6-2 achieved a major breakthrough in integrating 9.3 million transistors over an area of 81 square millimeters due to the 0.25-micron five-metal process technology and local interconnect, shallow trench isolation process, The Pentium II still stays on the order of 7.5 million. With this 1.8 million silicon transistors, AMDK6-2 was able to achieve the same 100MHz FSB as the SLOT1-based Intel P Class II chip on the Super7 platform with the same SOCKET7 pin count as the previous 66MHz Socket 7 bus interface faster 50%, while the system performance can be increased by two (with processor speedometer). More importantly, thanks to AMD’s innovative 3DNow! Technology, the K6-2 offers customers worldwide a whole new level of 3D performance and realistic graphics.