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采用黏度计测定不同初始温度下环氧树脂的黏度,通过拟合法建立环氧树脂的工程黏度模型.将黏度模型引入树脂传递模塑(resin transfer molding,RTM)成型树脂流动模拟中,结合PAM-RTM软件模拟不同初始温度下树脂的填充过程,讨论树脂黏度变化对RTM成型过程树脂流动行为的影响.结果表明,随着树脂初始温度的上升,填充时间先降后升,在初始温度为40℃时填充时间最短.树脂黏度变化对大型结构件RTM成型影响显著.
The viscosity of epoxy resin was measured by viscometer and the viscosity of epoxy resin was established by fitting method.The viscosity model was introduced into the resin flow molding (RTM) RTM software was used to simulate the filling process of resin under different initial temperatures and the influence of resin viscosity on the resin flow behavior during RTM molding was discussed.The results showed that the filling time decreased first and then increased with the increase of resin initial temperature and the initial temperature was 40 ℃ When the filling time is the shortest.Changes in resin viscosity of large structural parts RTM molding significantly.