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通过使用高导热封装材料及热传导效率高的热结构,从而显著降低器件的封装热阻,提高器件的温度等级,实现了一种最高工作温度达200℃的高速数据采集与处理系统级封装。该系统级封装由数字信号处理(DSP)、现场可编程门阵列(FPGA)、模拟-数字转换器(ADC)及存储器等外围器件组成,具有模拟信号数据采集、数字信号处理、串行通信、多路数字输入检测和输出控制等功能,其中差分输入模拟信号的最大可允许电压峰峰值为4 V,所用12 bit ADC最高采样频率为20 MHz,数据存储深度最大可配置为144 kbit,测试表明其在25~200℃环境温度内,信号幅度的变化在0.4 d B内,较好地解决了高温测井仪器高速数据采集问题。
Through the use of high thermal conductivity packaging materials and thermal conductivity of high thermal structure, thereby significantly reducing the device package thermal resistance and improve the temperature level of the device to achieve a maximum operating temperature up to 200 ℃ high-speed data acquisition and processing system-level package. The system-in-package consists of peripheral devices such as digital signal processing (DSP), field programmable gate array (FPGA), analog-to-digital converter (ADC) and memory with analog signal data acquisition, digital signal processing, serial communication, Multi-channel digital input detection and output control functions, including differential input analog signal maximum allowable peak-to-peak voltage of 4 V, 12-bit ADC maximum sampling frequency of 20 MHz, the maximum data storage depth can be configured for 144 kbit, the test shows The signal amplitude changes within 0.4 d B at ambient temperature of 25 ~ 200 ℃, which solves the problem of high speed data acquisition of high temperature logging instrument well.