Interface structure of ultrasonic wedge bonding joints of Ni/Al

• 作 者: 李军辉 韩雷 钟掘
• 机 构: SchoolofMechanical-ElectronicalEngineering
• 出 处: 中国有色金属学会会刊：英文版
• 发表日期: 2005年4期
• 关键词: Ni/Al 超声波 电路 变频器 电子信号 Ni/Al electronics packaging wedge bonding microstructur
• 基金项目: 国家自然科学基金，国家重点基础研究发展计划(973计划)

Nickel plated on a copper plate was selected as a bond surface for ultrasonic aluminum wedge bonds, and a series of experiments were carried out to study the microstructure characterization of the wedge bond interface.Bond lift-off characteristics were st