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电子工业中印刷线路板下料工序要求生产率高、下料断口质量好。目前采用的方法有剪板机下料,冲模落料,圆盘下料和板料的滚剪等。印刷线路板用单面或双面覆铜板制造,材质由纸基或环氧玻璃纤维基等非金属基板覆盖以0.06毫米左右的铜箔组成、总厚度一般为1.2至1.5毫米,无论用什么方式下料剪裁都极易出现撕裂现象。当前国内外都认为是先进的圆盘下料机,使用时生产率高,下料精度也高但噪声大,粉尘大,材料切口损耗也大。为此,滚剪有一定优越性,不过
Printed circuit board cutting process in the electronics industry requires high productivity, good quality of the material. The current method of cutting plate shears, die blanking, disc cutting and sheet metal cutting and so on. Printed circuit board with single or double-sided CCL, made of paper-based or epoxy glass fiber base and other non-metallic substrate covered with about 0.06 millimeters of copper foil, the total thickness is generally 1.2 to 1.5 mm, no matter what way Cutting under the material are prone to tearing. At home and abroad are considered advanced disc feeder, the use of high productivity, high precision blanking but the noise, dust, material cutting loss is also large. For this reason, rolling has some advantages, however