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杰尔系统(Agere Systems)日前宣布推出五款高性能的射频超模压塑封装晶体管,将使封装成本下降高达25%。杰尔的解决方案不仅能够降低基站的整体成本,而且还可加快无线基站放大器设备的大规模部署。这些塑料封装的晶体管将用于无线基站放大器——无线基站中最昂贵的组件之一。
Agere Systems today announced the release of five high-performance RF overmolded transistors that will reduce packaging costs by up to 25%. Agere’s solution not only reduces the overall cost of a base station, but it also speeds the large-scale deployment of wireless base station amplifier equipment. These plastic-encapsulated transistors will be used in wireless base station amplifiers - one of the most expensive components in wireless base stations.