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正当人们希望SMT的尺寸需要继续减小时,于是便出现了引线间距为0.010in、0.015in、0.020in,中心距为0.025in的细间距表面安装封装。目前50mil间距的封装实际只限于120条输入/输出引线,但最新的VLSI技术要求每个管壳高达300多条输入/输出引线。引线数增加和表面安装器件之间的间隔变小的一些实例如图1所示。大概你已经听到过而且也可能遇到过关于缺乏表面安装标准化的一些问题。到现在为止,还没有见到过表面安装技术的标准!进一步来说,如果要应用FPT,那
Just as people wanted the SMT size to continue to decrease, fine-pitch surface-mount packages with lead spacings of 0.010 in, 0.015 in, 0.020 in, and 0.025 in center were introduced. The current 50mil pitch package is actually limited to 120 input / output leads, but the latest VLSI technology requires up to 300 I / O leads per package. Some examples of the increase in the number of leads and the decrease in the distance between the surface mount devices are shown in FIG. 1. Probably you’ve heard about it and you may also have some problems with the lack of standardization of surface mount. Up until now, I have not met the standard of surface mount technology! Furthermore, if FPT is to be applied, then