Development of Replating Pb/Cu Superconducting Cavities

• 作 者: ZHU Fei PENG Zhao-hua
• 机 构: Department of Nuclear Physics,
• 出 处: Annual Report of China Institute of Atomic Energy
• 发表日期: 2016年00期
• 关键词: removing plating quickly peroxide affecting additive uniformity

The replating procedure of Pb/Cu superconducting cavities includes a lead removing procedure and a lead plating procedure.In the removing procedure,30%hydrogen peroxide solution is used,which removes lead film quickly(Fig.1)and does not affect surface of copper base(Table 1).

The replating procedure of Pb / Cu superconducting cavities includes a lead removing procedure and a lead plating procedure. In the removing procedure, 30% hydrogen peroxide solution is used, which removes lead film quickly (Fig.1) and does not affect surface of copper base (Table 1).