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将有机硅单体(D4)与丙烯酸丁酯(BA)、甲基丙烯酸甲酯(MMA)、丙烯腈(AN)和丙烯酸(AA)等单体进行共聚,反应后期再引入乙烯基硅烷偶联剂(A-151)作为交联剂,合成出无甲醛低温自交联型网印粘合剂。分析了D4和A-151的加入顺序和用量对该粘合剂性能的影响。结果表明:采取先D4开环、后期加入A-151的聚合工艺,并且当w(D4)≤6%(相对于单体总量而言)和w(A-151)=3%～5%(相对于单体总量而言)时,粘合剂具有胶膜不易黏连、耐水性优、柔软度佳和摩擦牢度好等特点,并可实现低温(100℃)自交联。
The organosilicon monomer (D4) was copolymerized with monomers such as butyl acrylate (BA), methyl methacrylate (MMA), acrylonitrile (AN) and acrylic acid (AA) Agent (A-151) as a cross-linking agent to synthesize formaldehyde-free low-temperature self-crosslinking screen printing adhesive. The effects of the order and dosage of D4 and A-151 on the properties of the adhesive were analyzed. The results show that the polymerization process with D4 ring opening and later A-151 addition is adopted, and when w (D4) ≤6% (relative to the total amount of monomers) and w (A-151) = 3-5% (Relative to the total amount of monomers), the adhesive has the characteristics of easy adhesion of the film, excellent water resistance, good softness and good rubbing fastness, and low temperature (100 ℃) self-crosslinking.