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在半导体光电器件管壳零件的加工中，陶瓷、不锈钢和可伐等不导磁材料的磨削加工长期以来都是一大难题。文章介绍了一种新颖的方法，解决了这一难题。详细叙述了关键技术及其工艺方法。
In the processing of semiconductor optoelectronic device tube parts, grinding of non-magnetic materials such as ceramics, stainless steel and Kovar has long been a major challenge. The article introduced a novel method to solve this problem. Described in detail the key technologies and processes.