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应用固态扩散焊方法制备出钼/铜(Mo/Cu)复合棒接头,利用金相显微镜、扫描电镜和显微硬度计、拉伸压剪分离等试验手段分析了复合界面的组织特征及力学性能。结果表明:在Mo/Cu物理界面两端形成了数十微米宽的扩散层,扩散层的显微硬度值高于铜棒的硬度值而小于钼棒硬度值;结合界面的抗拉强度相当于Cu基体强度的40%;结合界面的剪切强度与Cu基体剪切强度相当,可以满足以剪切强度为承载方式的性能要求。
The molybdenum / copper (Mo / Cu) composite rod joints were prepared by solid state diffusion welding. The microstructure and mechanical properties of the composite interface were analyzed by means of metallographic microscope, scanning electron microscopy, microhardness tester, . The results show that the diffusion layer with a width of tens of microns is formed at both ends of the Mo / Cu physical interface. The microhardness of the diffusion layer is higher than the hardness of the copper rod and less than that of the molybdenum rod. The tensile strength of the bonding interface is equivalent to Cu matrix strength of 40%; bonding interface shear strength and Cu matrix shear strength quite, to meet the shear strength of the bearing capacity requirements.