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“倒装芯片”是芯片面朝下安装在基片上的通称。这项技术已被应用30多年了,但到目前为止,倒装片只在一小部分公司使用。1998年,消耗了8.99亿片倒装片芯片,约占生产的600亿片 IC 芯片的1.5％。然而,在1998年,凸点圆片的数量比1997年同期增长了40％。倒装芯片的消耗量预计将以每年48％的速率增长,比 IC 片快了许多。2001年,将有29亿片以上的芯片采用倒装芯片组装,其中,20％的倒装芯片产自北美(占产值的80％)。广泛的应用和大量公司的
“Flip Chip” is a generic term for a chip that is mounted face down on a substrate. This technology has been in use for over 30 years, but so far flip-flops have only been used by a small number of companies. In 1998, 899 million pieces of flip-chip chips were consumed, accounting for about 1.5% of the 60 billion IC chips produced. However, in 1998, the number of bump wafers increased by 40% over the same period of 1997. Flip-chip consumption is expected to grow 48% annually, much faster than ICs. In 2001, more than 2.9 billion chips will be flip-chip assembled, of which 20% are produced in North America (80% of output). Wide range of applications and a large number of companies