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利用Gleeble-3500热模拟试验机对Al-Zn-Mg-Cu包铝板进行热变形,采用EBSD和XRD对不同变形条件下的Al-Zn-Mg-Cu基体和包铝层显微结构进行表征,其变形条件为变形量70%、温度380~450°C、应变速率0.1~30 s~(-1)。结果表明,变形温度、道次和变形速率直接影响样品的回复和再结晶过程,从而进一步影响其显微结构。在包铝层和Al-Zn-Mg-Cu基体中回复和再结晶的程度有所区别。较高的变形温度导致较高程度的再结晶以及较大的晶粒尺寸。在多道次变形中的停留时间内会发生静态再结晶。当应变速率低于10 s~(-1)时,随着应变速率的增大,出现较多细小的亚晶组织;然而,在30 s~(-1)的大应变速率条件下,试样在变形温度下停留时间较短,导致动态回复及再结晶程度受限。
The Al-Zn-Mg-Cu aluminum clad laminate was thermally deformed by Gleeble-3500 thermal simulator. The microstructure of Al-Zn-Mg-Cu matrix and aluminum clad laminate under different deformation conditions were characterized by EBSD and XRD. The deformation conditions for the deformation of 70%, temperature 380 ~ 450 ° C, the strain rate of 0.1 ~ 30 s ~ (-1). The results show that the deformation temperature, pass and deformation rate directly affect the sample recovery and recrystallization process, thereby further affecting its microstructure. The extent of recovery and recrystallization differs between the aluminum clad layer and the Al-Zn-Mg-Cu matrix. The higher deformation temperature results in a higher degree of recrystallization and a larger grain size. Static recrystallization occurs during the residence time in multi-pass deformation. When the strain rate is lower than 10 s -1, more fine subgrain occurs with the increase of strain rate. However, under the condition of large strain rate of 30 s -1, The residence time at deformation temperature is short, resulting in limited dynamic recovery and recrystallization.