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针对LED高光效、高显色指数的要求,在分析LED光学性能的基础上,采用板上芯片(COB,Chip on Board)技术研究了表面涂覆硅胶量对COB白光LED的光通量、光效、色温和显色指数的影响,并提出一种高光效、高显色指数、低色温的白光LED封装方案,提高了COB白光LED的出光效率,实现了特定的光学分布,最终实现14W COB封装结构下的白光LED,在电流密度为30A/cm2时,其色温、显色指数及光效分别为4 900K、82和125lm/W。
In order to meet the requirements of high luminous efficiency and high color rendering index of LED, based on the analysis of LED optical performance, the COB (Chip on Board) technology was used to study the effects of surface coating amount of silica gel on the luminous flux, Color temperature and color rendering index. A white light LED package with high luminous efficiency, high color rendering index and low color temperature is proposed to improve the light output efficiency of the COB white LED and achieve a specific optical distribution. Finally, a 14W COB package structure Under the white LED, the current density of 30A / cm2, its color temperature, color rendering index and luminous efficiency were 4 900K, 82 and 125lm / W.