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在半导体装配工艺中主要是芯片封装,从制造晶体管的初期到目前为止一直采扩凭借操作者将引线一条一条地焊接起来的方法。但是,随着电子装备的高度化、复杂化,集成电路的集成度也在从小规模向中觌模、大规模方向发展,这样,一个芯片内的电极数目也增多了,为了增大集成度就需要把多数个中规模、大规模集成电路芯片封装在一个管壳里。随着对这种多芯片大规模集成电路需要的增加,原来主要靠操作技巧的手动引线焊接装配方式已不适应生产的要求。因为此种方式不但效率低,而且也不可靠,目前正朝着自动引线焊接或者无引线焊接的方向急速发展
In the semiconductor assembly process is the main chip package, from the beginning of the manufacture of transistors has been adopted since the expansion by virtue of the operator to weld the leads one by one method. However, as the electronic equipment becomes more sophisticated and sophisticated, the integration of integrated circuits has also been moving from a small scale to a large scale. As a result, the number of electrodes in a chip has also increased. In order to increase the integration level Most of the large-scale, large-scale integrated circuit chips need to be packaged in a single package. With the increased need for such multi-chip LSI, the original manual lead wire assembly method that used to rely mainly on operating skills has not met the requirements of production. Because of this method is not only inefficient, but also unreliable, is now moving toward automatic lead soldering or lead-free soldering direction of rapid development