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本文研究了铜上锡和锡—40铅镀层,经热熔和热老化处理的可焊性。热老化的目的是,促使铜锡金属化合物的生长发展。较厚的金属化合物能降低可焊性。但是,这种对可焊性的影响,实际上是与试样上剩余未反应的镀层厚度密切相关。如果给定的热熔锡镀层或焊料镀层厚度足够,则在真空中就能耐受住较大范围的热老化试验。以前论文指出,在高温贮存期间由于金属化合物的生长降低了铜上锡或锡—40铅合金镀层的可焊性。与早先的看法不相同,以上论文认为,在金
This article studies the solderability of hot-melt and heat-aged tin and tin-40 lead coatings on copper. The purpose of thermal aging is to promote the growth of copper-tin metal compounds. Thicker metal compounds can reduce solderability. However, this effect on solderability is in fact related to the thickness of the remaining unreacted coating on the sample. Given a sufficient thickness of the hot-melt tin or solder coating, a greater range of thermal aging tests can be tolerated in a vacuum. Previous papers indicated that solderability of copper-on-tin or tin-lead-lead alloys was reduced by the growth of metal compounds during high temperature storage. Different from the previous view, the above thesis believes that in the gold