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应用材料公司日前宣布,面向晶圆级封装(WLP)产业推出Applied Nokota?电化学沉积(Electrochemical Deposition,ECD)系统,凭借优秀的电化学沉积性能、可靠性、晶圆保护能力、可扩展性,以及生产力,提供先进封装技术。在该系统的助力下,芯片制造商、外包装配和测试(OSAT)企业将可通过低成本、高效率的方式使用不同的晶圆级封装工艺,包括凸块/柱状、扇出、硅通孔(TSV)等等,满足日益增多的移动和高性能计算应用需求。相较于传统封装方案,全新晶圆级封装系统可显著提升芯片连接性与功
Applied Materials Inc. announced that it has introduced Applied Nokota® Electrochemical Deposition (ECD) systems for the wafer-level packaging (WLP) industry. With its excellent electrochemical deposition performance, reliability, wafer protection, scalability, As well as productivity, providing advanced packaging technology. With the help of this system, chip manufacturers, outsourced assembly and test (OSAT) companies will be able to use different wafer-level packaging processes in a cost effective and efficient manner including bump / column, fanout, through silicon vias (TSVs) and more to meet the growing demand for mobile and high-performance computing applications. Compared with traditional packaging solutions, the new wafer-level packaging system can significantly improve the chip connectivity and power