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显示过去一年半导体器件研究水平的第37届国际固体电路会议(ISSCC),1990.2.14～16在美国旧金山市召开.从会议发表的论文来看.与过去一年相比,半导体电路的速发、密度及性能等都有较大的进展.值得注意的是,会上有几乎1/3的论文介绍了BiCMOS 和亚微米CMOS 技术的应用.并且首次发表了Josephson 结和经络阵列的实际应用.这就清楚地表明,这些技术已经处于开始广泛应用阶段,下面分四个方面介绍.微处理机与一年前相比,速度和密度都提高了一倍,与三年前相
The 37th International Solid State Circuits Conference (ISSCC), which shows the level of semiconductor research in the past year, was held in San Francisco from January 14 to December 14, 1990. According to papers published at the conference, compared with the past year, the speed of semiconductor circuits Significant progress has been made in terms of hair, density, and performance, etc. It is noteworthy that almost one-third of the papers presented at the conference covered the application of BiCMOS and sub-micron CMOS technology and first published the practical application of Josephson junctions and meridian arrays .This clearly shows that these technologies are already in the beginning of a wide range of applications, the following four aspects.Microcomputer than a year ago, the speed and density have doubled, and three years ago