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研究了机械合金化制备Ag-Cu-Sn三元体系形成过饱和固溶体的可能性,并对所得到的非平衡球磨产物的组织结构、热稳定性及其铺展重熔后的金相组织进行了表征。结果表明,通过控制球磨工艺和第三组元含量,可得到以过饱和固溶体为主要组成相的钎料合金粉,减少或细化脆性金属间化合物相。真空退火时,富银固溶体相较稳定,富铜固溶体相易于分解生成Cu_3Sn,银锡化合物可分解形成Ag基固溶体和富锡相,铜锡化合物的分解产物则为多种中间相,随退火温度的升高,转变顺序逐渐向铜锡原子比例增大的方向进行。以过饱和固溶体为主要组成相的钎料合金粉在重熔后虽然仍存在金属间化合物相,但金相组织明显细化。
The possibility of forming a supersaturated solid solution of Ag-Cu-Sn ternary system by mechanical alloying was studied. The microstructure, thermal stability and the remelted microstructure of the obtained non-equilibrium ball milled product were studied. Characterization. The results show that by controlling the milling process and the content of the third component, the solder alloy powder with the supersaturated solid solution as the main phase can be obtained and the brittle intermetallic compound phase can be reduced or refined. In vacuum annealing, the silver-rich solid solution is relatively stable, the copper-rich solid solution phase is easily decomposed to form Cu_3Sn, the silver-tin compound can be decomposed to form an Ag-based solid solution and a tin-rich phase, and the decomposition products of copper and tin compounds are various mesophases. Of the increase, the order of transition to the copper-tin atomic ratio increases in the direction. Although the intermetallic compound phase still exists after remelting, the microstructure of the solder alloy with supersaturated solid solution as the main phase is obviously refined.