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对微结构光纤磁场传感器的增敏性能进行研究,设计了一种基于飞秒激光微加工的均分直槽型微结构光纤磁场传感器。利用飞秒激光在刻有光纤布拉格光栅(FBG)的单模光纤(SMF)包层上刻蚀均分直槽微结构,并采用HF溶液清除直槽内的残留碎屑和应力集中点,随后用磁控溅射技术在加工部位溅射一层磁致伸缩薄膜TbDyFe。当外界磁场强度变化时,通过观测传感器中心波长的变化可实现对磁场强度的测量。直槽微结构能减小光纤横截面积,改善光纤轴向伸缩性能,增大薄膜附着表面积,从而提高传感器探头灵敏度。理论分析了直槽微结构提高传感器性能的工作原理,介绍了传感器探头的制备工艺和性能影响因素,给出了不同参数传感探头的磁场测试结果。实验结果表明,利用飞秒激光加工直槽微结构能明显改善传感器探头灵敏度,其中直槽个数对性能影响最为明显;相对于无微结构传感器探头,有微结构光纤探头灵敏度最高可提升3.8倍。
The sensitization performance of microstructured optical fiber magnetic field sensor was studied, and a uniform straight slot type microstructured fiber magnetic field sensor based on femtosecond laser micromachining was designed. The homogenized straight grooved microstructure was etched using a femtosecond laser on a single mode fiber (SMF) clad with a fiber Bragg grating (FBG) and the residual solution and stress concentration points in the straight slot were cleaned with HF solution followed by Magnetron Sputtering Technology Sputtered a layer of magnetostrictive film, TbDyFe, at the processing site. When the external magnetic field intensity changes, the magnetic field intensity can be measured by observing the change of the sensor center wavelength. Straight groove microstructure can reduce the fiber cross-sectional area, improve the optical fiber axial stretching performance, increase the film attachment surface area, thereby enhancing the sensitivity of the sensor probe. Theoretical analysis of the principle of straight slot micro-structure to improve the performance of the sensor works, introduced the sensor probe preparation process and performance factors, given the different parameters of the sensor probe magnetic field test results. The experimental results show that the sensitivity of the sensor probe can be significantly improved by using the straight-slot micro-structure fabricated by femtosecond laser, in which the number of straight slots has the most significant effect on the performance. Compared with the sensor without micro-structure, the sensitivity of the micro-structured fiber probe can be increased up to 3.8 times .