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本文介绍了用标准芯片法测量半导体器件的封装热阻的测试原理及测量装置,并对该测量系统的重复性及误差进行了讨论。通过对半导体PN结温度系数的研究发现:温度系数的测定准确性主要与被测点的温度范围有关,而与所选温度点的个数关系不大.最后本文对半导体器件开帽与不开帽测量热阻进行了讨论.
This paper introduces the test principle and measuring device for measuring the package thermal resistance of semiconductor devices by the standard chip method. The repeatability and error of the measuring system are also discussed. Through the study on the temperature coefficient of the PN junction, it is found that the accuracy of the temperature coefficient is mainly related to the temperature range of the measured point, but not the number of the selected temperature points.Finally, Cap measurement of thermal resistance is discussed.