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本文主要讨论微机电系统中的常用材料和加工技术。具体分析了Si、GaAs、SiC、金刚石和石英等材料的性能及其在微机电系统中的应用 ,并论述了材料的各向同性和各向异性刻蚀加工技术以及材料间的键合工艺。
This article focuses on MEMS commonly used materials and processing technology. The properties of Si, GaAs, SiC, diamond and quartz and their applications in microelectromechanical systems are analyzed in detail. The isotropic and anisotropic etching process of materials and the bonding process between materials are discussed.