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报道了用传统固态烧结工艺制备的金属 PTC陶瓷复合材料的NTC现象 ,研究结果表明这种NTC现象是由于镜像力作用导致金属半导体肖特基势垒高度减低所致。
The NTC phenomenon of metal PTC ceramic composites prepared by the traditional solid state sintering process is reported. The results show that this NTC phenomenon is due to the decrease of the Schottky barrier height of the metal semiconductor due to the image force.