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受控倒塌芯片连接新工艺是一种由IBM公司开发、由Suss Micro Tec公司推向商品化的新型焊凸形成技术。受控倒塌芯片连接新工艺采用各种无铅焊料合金致力于解决现有的凸台。形成技术限定,使低成本小节距焊凸形成成为可能。受控倒塌芯片连接新工艺是一种焊球转移技术,熔焊料被注入预先制成并可重复使用的玻璃模板(模具)。这种注满焊料的模具在焊料转入圆片之前先经过检查以确保高成品率。注满焊料的模具与圆片达到精确的接近后以与液态熔剂复杂性无关的简单工序转移在整个300mm(或300mm以下)圆片上。受控倒塌芯片连接新工艺技术能够在焊膏印刷中实现小节距凸台形成的同时提供相同合金选择的适应性。这种简单的受控倒塌芯片连接新工艺使低成本、高成品率以及快速封装周期的解决方法对于细节距FCiP以及WLCSP凸台形成均能适用。
The new technology for controlled-to-collapse chip bonding is a new solder bump formation developed by IBM and commercialized by Suss Micro Tec. Controlled Collapse Chip Joins the New Process With a variety of lead-free solder alloys dedicated to solving existing bosses. The formation of technical limitations, so that low-cost small pitch solder bump formation possible. The new technology for controlled-collapse chip bonding is a solder ball transfer technique where molten solder is injected into pre-made and reusable glass forms (molds). This solder-filled mold is inspected before the solder is transferred to the wafer to ensure high yields. After the solder-filled mold and wafer are precisely aligned, they are transferred over the entire 300 mm (or 300 mm) wafer in a simple process that is independent of the complexity of the liquid flux. Controlled Collapse Chip Bonding New process technology provides the same choice of alloy as the small pitch bump formation in solder paste printing. This simple, controlled-collapse chip-on-board new process enables low-cost, high-yield, and fast package-cycle solutions to be fine-tuned for FCiP and WLCSP bosses.