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平面磨削中工件温度场采用红外成像的电荷偶合装置 (CCD)测量。在高空间、瞬时条件下红外辐射 (IR)温度测量一直是沿磨削试件一侧进行测定试件表面和次表面的温度。用斜面磨削的方法 ,使磨削深度持续增加 ,获得了随材料磨除率而改变的磨削温度的变化。这些测量结果与用传统的恒磨除率磨削试验具有良好的相关性。确定了最高温度的位置和值 ,包括温度梯度。讨论了确定磨削热模型测量的含意及工件的烧伤苗头的预测。
The workpiece temperature field in plane grinding is measured by CCD (Charge Coupled Device) with infrared imaging. Infrared Radiation (IR) temperature measurements in high-altitude, transient conditions have been taken along the side of the specimen being ground to determine the temperature at the surface and subsurface of the specimen. With the method of bevel grinding, the grinding depth is continuously increased, and the change of the grinding temperature which is changed with the material removal rate is obtained. These measurements have good correlation with the conventional constant abrasive removal rate grinding test. The location and value of the highest temperature are determined, including the temperature gradient. The implications of determining the measurement of the grinding heat model and the prediction of the burn head of the workpiece are discussed.