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在晶圆背面涂覆工艺中采用芯片粘结剂作为浆料,将其涂覆到晶圆背面之后再烘干。其优点是同干膜方法相比成本降低20-30%。可以控制键合层厚度并且得到更高的单位时间产量。
The wafer backside coating process uses a die bonding agent as a slurry, which is applied to the back of the wafer and then dried. The advantage is a 20-30% reduction in cost compared to dry film methods. The thickness of the bonding layer can be controlled and a higher yield per unit time can be obtained.