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采用LSI封装显著地增加了每个硅片上电路的数目,同时也大大增加了其热流密度。这与早期的MST(单片技术)产品相比,新型多芯片衬底(≥100个芯片)必须传输出去的热流增加了一个或一个以上数量级。本文讨论一种改进的传导冷却方法,这种封入氦气的方法是根据新的LSI技术的需要而研究的。该方法以封入液体的组件技术为基础,本文描述了在构成一个从单个芯片到组件和冷却板的热通路中所遇到的基本问题。基础计算理论是目前应用的一维数学方法和分立模拟模型。并用这些模型说明了各种因素的影响,如几何形状、芯片倾斜、氦气浓度、气体漏速和材料等。为了确定结温的变化和一些主要参数的贡献,进行了热敏分析。继这篇文章之后,Oktay和Kammerer写了同类文章,他们用数字分析技术进行了更为常见的多维分析。
LSI packaging significantly increases the number of circuits per silicon, while also greatly increasing its heat flux. This is an increase of one or more orders of magnitude more heat flow that the new multi-chip substrate (≧ 100 chips) must transmit compared to earlier MST (monolithic) products. This article discusses an improved conduction cooling method that is tailored to the needs of new LSI technologies. The method is based on a liquid-filled assembly technique and this article describes the basic problems encountered in forming a thermal path from a single chip to an assembly and a cooling plate. The basic computational theory is the one-dimensional mathematical method and discrete simulation model applied at present. These models illustrate the effects of various factors such as geometry, chip tilt, helium concentration, gas leak rates, and materials. In order to determine the changes in junction temperature and the contribution of some of the major parameters, a thermal analysis was performed. Following this article, Oktay and Kammerer wrote the same article, using the more common multidimensional analysis of digital analysis techniques.