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This study was conducted to investigate the influence of pulse parameters on the surface morphology and crystal orientation of the tungsten coatings electrode-posited on pure copper substrates. The deposited coatings were analyzed by X-ray diffraction (XRD), scanning electron microscopy (SEM) and energy-dispersive spec-trometer (EDS). SEM analysis indicates that pulse parameters have significant influences on the surface morphology of the deposited coatings. Meanwhile, the change in grain size of the tungsten coatings demonstrates that the change in frequency and duty cycle could cause the variation of nucleation rate and grain growth of deposits. Moreover, no obvious diffusion layer at the coating/sub-strate interface is found by line analysis of EDS. XRD results reveal that tungsten coatings are of bcc structure and the preferred orientation of the deposits varies with duty cycle and period.