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AMD公司近期宣布了在中国设立新的封装测试(TMP)厂的计划。此微处理器封装测试厂将位于中国的苏州工业园区,紧邻AMD于1995年斥资建立的闪存封装测试厂——封装测试Spansion TM闪存产品的FASL(苏州)有限公司。这一新的生产厂将占地近11000平方米,预计于今年第四季度投入运营和批量生产。此封装厂已获批准的总投资为1亿美元。据悉,该生产厂将封装测试第七代微处理器,并将在稍后时间封装测试第八代微处理器产品。
AMD recently announced plans to set up a new packaging test (TMP) plant in China. The microprocessor package test facility will be located in China’s Suzhou Industrial Park next to FASL (Suzhou) Co., Ltd., a Flash package testing facility AMD invested in in 1995 to package and test Spansion ™ flash memory products. The new plant will occupy nearly 11,000 square meters and is expected to be put into operation and mass production in the fourth quarter of this year. The packaging plant has been approved for a total investment of 100 million US dollars. It is reported that the manufacturing plant will test the seventh generation of microprocessors, and will test and test the eighth generation of microprocessors at a later time.