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考虑工艺参数扰动对互连电路传输性能的影响,建立了基于工艺扰动的互连线随机模型.通过改进的去耦算法对随机互连线元进行去耦,结合随机伽辽金方法(SGM)和多项式混沌展开(PCE)进行互连分析,进而利用复逼近及二分法给出工艺参数扰动下互连时延的有限维表达式.仿真实验结果不仅与SPICE仿真吻合得较好,相较于SPICE蒙特卡洛仿真还具有更高的计算效率.
Considering the influence of the process parameters on the transmission performance of the interconnection circuit, a stochastic interconnection model based on process disturbances is established. The decoupling algorithm is used to decouple the random interconnection elements and the random Galerkin method (SGM) (PCE) is used to carry out interconnection analysis, then the complex approximation and dichotomy method are used to give the finite-dimensional expression of the interconnection delay under the disturbance of process parameters.The simulation results are not only in good agreement with the SPICE simulation, SPICE Monte Carlo simulation also has a higher computational efficiency.