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磁控溅射是一项成熟的技术,可用在各种基体上沉积高质量金属及陶瓷涂层。然而,此项技术一般并不适于涂镀微粒粒度为nm或μm到100μm的细微粒涂层。本文详述了一种可涂镀微粒粒径在上述范围的均匀功能薄膜的技术。在磁场下面安放的一个碗状容器内放有微粒子,容器可以振动可使粒子均匀地振出碗边沉落到真空腔,薄膜沉积工艺为反应或非反应脉冲磁控溅射。Ti,Ti O2,Sn及Sn O2从单磁场源沉积,而Bi/W的氧化物从双磁场源沉积。用SEM,TEM和EDX,以及其它与应用相关的技术表征所沉积的微粒,以表明此项技术的潜在功能。
Magnetron sputtering is a proven technology for depositing high quality metallic and ceramic coatings on a variety of substrates. However, this technique is generally not suitable for coating fine particle coatings with a particle size of nm or μm to 100 μm. This article details a technique for coating a uniform functional film having a particle diameter in the above range. A bowl-shaped container placed below the magnetic field contains particles that vibrate to allow the particles to vibrate evenly out of the bowl and fall into the vacuum chamber. The film deposition process is reactive or non-reactive pulsed magnetron sputtering. Ti, Ti O2, Sn and Sn O2 are deposited from a single magnetic field source while Bi / W oxide is deposited from a dual magnetic field source. The deposited microparticles are characterized by SEM, TEM and EDX, as well as other application-related techniques to demonstrate the potential function of this technique.